1 silicon double balanced hmic mixer 700 - 1200 mhz m/a-com products rev. v3 ma4ex950h1-1225t advanced: data sheets contain information regarding a product m/a-com is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com has under develop- ment. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. pin function pin function 1 rf 4 gnd 2 gnd 5 if 3 lo model no. package ma4ex950h1-1225t tape and reel mamx-000950-000smb sample test board features ? 7.0 db typical conversion loss ? +13 to +17 dbm lo drive ? hmic ic process ? silicon high barrier schottky barrier diodes ? dc - 400 mhz if bandwidth ? low cost miniature plastic package ? rohs* compliant with 260c reflow capability ? 100% matte tin plating description m/a-com?s ma4ex950h1-1225t is a silicon monolithic 700 - 1200 mhz, high barrier, double balanced mixer in a low cost miniature surface mount sot25 package. the die uses m/a-com?s unique hmic silicon/glass process to realize low loss passive elements while retaining the advan- tages of high barrier silicon schottky barrier diodes. applications these mixers are well suited for high volume wire- less and cellular applications where small size and repeatability are required. typical applications in- clude frequency conversion, modulation, and de- modulation in wireless receivers and transmitters. package outline pin configuration ordering information electrical specifi cations @ 25c parameter frequency range test conditions units min. typ. max. conversion loss 800 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf = -10 dbm, if = 60 mhz db db ? ? 6.6 8.1 7.5 10.5 l - r isolation 800 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf level = -10 dbm db db ? ? 27.5 23.0 ? ? l - i isolation 800 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf level = -10 dbm db db ? ? 28.5 28.5 ? ? r - i isolation 800 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf level = -10 dbm db db ? ? 25.0 22.5 ? ? rf vswr 800 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf level = -10 dbm ratio ratio ? ? 1.20:1 1.50:1 ? ? if vswr dc - 400 mhz lo drive = +15 dbm rf level = -10 dbm ratio ? 1.55:1 ? input ip3 850 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf = -5 dbm, if = 60 mhz dbm dbm 21.0 20.0 23.8 25.0 ? ? input 1 db compression 850 mhz 0.7 - 1.2 ghz lo drive = +15 dbm rf = -5 dbm, if = 60 mhz dbm dbm ? ? 8.3 9.1 ? ? if 1 db bandwidth dc - 400 mhz lo = 850 mhz @ +15 dbm mhz 0 ? 400
2 silicon double balanced hmic mixer 700 - 1200 mhz m/a-com products rev. v3 ma4ex950h1-1225t advanced: data sheets contain information regarding a product m/a-com is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com has under develop- ment. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. parameter maximum ratings operating temperature -40c to +85c storage temperature -65c to +150c incident lo power +20 dbm incident rf power +20 dbm 1. exceeding these limits may cause permanent damage. lo if rf 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 700 750 800 850 900 950 1000 1050 1100 1150 1200 50 100 150 200 250 300 350 400 450 500 frequency (mhz) vswr r port i port 0 5 10 15 20 25 30 35 700 750 800 850 900 950 1000 1050 1100 1150 1200 frequency (mhz) ip3 (dbm) 1db com p ression pt. plo = 17dbm plo = 15dbm plo = 13dbm -11.00 -10.00 -9.00 -8.00 -7.00 -6.00 -5.00 700 750 800 850 900 950 1000 1050 1100 1150 1200 frequency (mhz) loss (db) plo = 17dbm plo = 13dbm plo = 15dbm -40 -35 -30 -25 -20 -15 -10 -5 0 700 750 800 850 900 950 1000 1050 1100 1150 1200 frequency (mhz) isolation(db) r-i l-i l-r absolute maximum ratings schematic conversion loss isolation vswr input ip3 & 1 db compression
3 silicon double balanced hmic mixer 700 - 1200 mhz m/a-com products rev. v3 ma4ex950h1-1225t advanced: data sheets contain information regarding a product m/a-com is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com has under develop- ment. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. case styles mounting information the illustration indicates the recommended mounting pad configuration for the sot-25 package. solder paste containing flux should be screened onto the pads to a thickness of 0.005- 0.007 inches. the plastic package is placed in position, firmly adhering to the solder paste. permanent attachment is performed by a reflow soldering procedure during which the tab temperature does not exceed +275 c and the body temperature does not exceed +260 c for the rohs compliant devices. please refer to application note m538 for surface mounting instructions. inches millimeters dim min max min max a 0.106 0.122 2.70 3.10 b 0.100 0.118 2.54 3.00 c - 0.051 - 1.30 d .063 ref. 1.60 ref. e 0.032 0.043 0.80 1.10 f 0.014 0.020 0.35 0.50 g 0.003 - 0.08 - h 0.000 0.006 0.00 0.15 j 0.018 ref. 0.45 ref sot-25 2. leads coplanarity should be 0.003 (0.08) max.
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